WikiSTEP - New pages [en]

PDTec instance explorer link

2012-03-26T19:37:04Z

Tom Thurman:

http://www.pdtec.de/support/download_instance_explorer.aspx
The file is "PDTec Instance Explorer Setup" version 3.1.17.

PDES-181

2012-02-13T00:45:55Z

Tom Thurman: Created page with "* PDES-181.stp"

* [[Media:PDES-181.stp|PDES-181.stp]]

PMI

2010-04-20T16:09:31Z

Lothar Klein:

This page is under construction !

Product manufacturing information, also abbreviated PMI, conveys non-geometric attributes in 3D computer-aided design (CAD) and Collaborative Product Development systems necessary for manufacturing product components or subsystems. PMI may include geometric dimensions and tolerances, 3D annotation (text) and dimensions, surface finish, and material specifications. CAD application literature may also refer to PMI synonymously with Geometric Dimensions and Tolerances (GD&T) or Functional Tolerancing and Annotation (FT&A).
See corresponding information on Wikipedia:
* http://en.wikipedia.org/wiki/Product_manufacturing_information
* http://en.wikipedia.org/wiki/GD%26T

The information provided here is supported by AP203ed2 and to a big degree also by AP214.

== Geometry ==
Nonetheless that PMI is focusing on non-geometric information, geometric representations are required to link to.

=== Geometric product model ===
The geometric model of a product is represented by a shape_representation. STEP offers some 20 different specializations of shape_representation, but for the purposes of GD&T you should use '''advanced boundary representation''' only, see AM 1541 a wrapper for AIC 514. For the MIM/IR implementation we have to refer to these entities:
* advanced_brep_shape_representation, a subtype of shape_representation that requires a 3D coordinate system, established by a geometric_representation_context
* advanced_face, a topological bounded surface
* oriented_edge, a topological bounded curve
* vertex_point, the topological representation of a cartesian_point
* axis2_placement_3d that is used to define local coordinate systems within the 3D geometric_representation_context

=== Supplemental geometry ===
Supplemental or constructive geometry are all the geometric elements that are needed to define the shape of a product, but that are not themselves part of the shape of a product. AM 1131 "Construction geometry" defines constructive_geometry_representation that is the collector of all these geometric elements. The valid entities are:
* placement, either axis2_placement_2d or axis2_placement_3d
* curve, bounded or unbounded
* edge
* face
* point, in most cases cartesian_point
* surface
* face_surface
* vertex_point
A constructive_geometry_representation is linked to the corresponding advanced_brep_shape_representation by a constructive_geometry_representation_relationship. Both representations must share the same 3D geometric_representation_context.

=== Draughting model ===
xxx

A draughting_model includes the shape_representations and constructive_geometry_representation by a mapped_item with an identity transformation. These representations must share the same 3D geometric_representation_context

=== Presentation and drawings ===

== Non-geometrical information ==
=== Shape abstraction ===
Throughout STEP the term '''shape''' is used to refer to geometric information without having any detailed geometric information.
* product_definition_shape represents the shape of a product. A shape_definition_representation links it to the corresponding geometric model
* shape_aspect that identifies a portion of the shape of a product. The attributes product_definitional defines on whether the shape_aspect is part of the item_shape.
* composite_shape_aspect, a subtype of shape_aspect that represents a collection of other shape_aspects
* derived_shape_aspect, a subtype of shape_aspect that is derived from one or more other shape_aspects. There are further specializations for apex, centre_of_symmetry, geometric_alignment, geometric_intersection, parallel_offset, perpendicular_to, extension and tangent

=== Dimensional tolerances ===

=== Geometric tolerances ===

=== Default tolerances ===

=== Surface conditions ===

=== Chemical substance ===

=== Material properties ===

=== Composites ===

Integration of developer’s API (JavaDoc) documentation and HTML standards documentation for AP210 query library

2010-04-02T21:48:14Z

Tom Thurman: New page: Integration of developer’s API (JavaDoc) documentation and HTML standards documentation for AP210 query library In order to facilitate development of AP210 applications, the Java progra...

Integration of developer’s API (JavaDoc) documentation and HTML standards documentation for AP210 query library

In order to facilitate development of AP210 applications, the Java programmer’s documentation of the
AP210 query library and JSDAI has been integrated with the HTML documentation of the AP210
standard.
Effective use of the AP210 query library requires repeated reference to the relevant AP210
ARM application objects and corresponding MIM entities.
A mechanism for enhancing the existing Java
API documentation through linking to the corresponding AP210 HTML referenced entities at the ARM
and MIM level has been developed.
Additionally, graphical entity instance diagrams have been extracted
and linked to the corresponding query methods to facilitate visual interpretation of the relationships
between the relevant entities.
Finally, the documentation was enhanced with additional detail and
numerous (linked) references to applicable ARM application objects and MIM entities.
The most recent updates to the query library (delivered 12/3/09) included significantly expanded queries
for extraction of PCA/PCB data, new queries for the purpose of extracting data from AP210 package
models, and queries to aid end-users in the extraction and interpretation of parametric data related to
products and packages. The Java source code resides in the package com.sfm.ap210.jsdai.
The current query library consists of approximately 100 methods contained in the MIMqueries,
MIMpackageQueries, and MIMparamQueries interfaces as well as the 100+ supporting lowerlevel
operation methods (MIMops).
The queries have been implemented in Java using a library known as
the JSDAI developed by LKSoftWare GmbH. LKSoft licenses the JSDAI under both commercial and
open-source terms1.
An algorithm for methodical traversal of the AP 210 model has also been provided in
order to demonstrate the successful integration of these queries and the ability to efficiently extract the
relevant data from an AP210 model.
Graphical and pseudo-code documentation of the queries has been
provided, as well as the Java source code for the implemented queries and supporting low-level
operations, as well as the traversal algorithm.
Javadoc is a tool from Sun Microsystems for generating API documentation in HTML format, and the
most common method for generating API documentation from Java source code2.
The Javadoc tool supports development of custom tags through Java classes that implement the Taglet3 interface.
To develop the integrated documentation, several custom tags were developed that enabled efficient
annotation of the Java source code to drive the generation of links with the HTML documentation of the
AP210 standard.

NOTE: This is a placeholder to ensure the published reference in ISO 10303-210:20010 is valid.
The published HTML of ISO 10303-210:2010 is not publicly available.
The files that are not copyright ISO will be posted here shortly.

Documentation and descriptions provided by SFM Technology and NIST

AP210 Scope

2009-11-18T22:29:31Z

Tom Thurman: New page: ====configuration control data pertaining to the design phase of a product's development:==== ====characterization data:==== *the association of characteristics to classes, functional obje...

====configuration control data pertaining to the design phase of a product's development:====
====characterization data:====
*the association of characteristics to classes, functional objects, physical objects, and analytical models;
*the identification of planned parameters for functional objects, assemblies, interconnect, components, and analytical models;
*the identification of actual parameters for functional objects, assemblies, interconnect, components, and analytical models;
*the description of catalog data including explicit capability for binding externally defined data element type identifiers to product data types;
*the configuration management of characterization data;
*representation of standard si units, derived si units and units defined in other systems of units;
*representation of class hierarchies for product data;
====interface data:====
*the behavioural description of devices or physical objects, including the functional interface definition;
*the description of the physical interface of devices or physical objects, including material characteristics and composition of the interface;
*the behavioural description of features realized as part of the interconnect, including the functional interface definition;
*the description of the physical interface of features realized as part of the interconnect, including material characteristics and composition;
*the mapping between the functional and physical interface definitions;
====simulation model data:====
*the configuration management of analytical model templates that are being developed concurrently;
*the explicit interface to externally defined analytical models that define the behaviour of a functional object, a device, a physical object, an electronic assembly, or an interconnect;
*the classification and description of analytical model template ports;
*the identification of analytical model template libraries;
====material data:====
*materials and their composition of chemical substance;
*composite material product structure, shape and material properties;
*classification of materials according to domain specific conductivity performance measures;
*characterization of surface conditions including surface finish;
====generic part or device data:====
*the functional description of devices or physical objects, including mapping between functional and physical terminals;
*the physical description of devices or physical objects, including material characteristics and composition;
*the configuration management of constituent parts or devices that are being concurrently developed;
*the identification of libraries used for synthesis and design re-use;
*catalogue data characterized by property value pairs or by data tables;
*substitute and alternate product data;
*approved supplier data;
====mechanical part data:====
*the physical description of devices or physical objects, including material characteristics and composition;
*the configuration management of constituent parts or devices that are being concurrently developed;
*the identification of libraries used for synthesis and design re-use;
*products that are mechanical parts;
*catalogue data characterized by property value pairs or by data tables;
====generic electrical part or device data:====
*the functional description of devices or physical objects, including mapping between functional and physical terminals;
*the physical description of devices or physical objects, including material characteristics and composition;
*the configuration management of constituent parts or devices that are being concurrently developed;
*the configuration management of programmable devices and assemblies;
*the identification of libraries used for synthesis and design re-use;
*products that are electrical parts;
*catalogue data characterized by property value pairs or by data tables;
====electrical part or device data specific to designs that include layered interconnect:====
*the functional description of devices or physical objects, including mapping between functional and physical terminals;
*the physical description of devices or physical objects, including material characteristics and composition;
*the configuration management of constituent parts or devices that are being concurrently developed;
*the configuration management of programmable devices and assemblies;
*the identification of libraries used for synthesis and design re-use;
*products that are electrical parts;
*catalogue data characterized by property value pairs or by data tables;
*the description of conductive pattern templates associated with the part or device;
*the externally accessible connection areas in the physical description of the device;
*the externally accessible surfaces in the physical description of the device;
*the classification of terminals in the physical description of the device;
*representation of interface and seating planes in the physical description of the device;
*the classification of device terminals;
*the physical description of terminal templates including connection areas;
*representation of the geometric relationship between two-dimensional and three-dimensional models of the device;
*representation of the shape of a device under different application contexts and material conditions;
*representation of an instance of a device in an assembly;
====bare semiconductor device specific data:====
*the device connection areas;
*the device surfaces;
*the classification of device terminals;
*representation of an instance of a device in an assembly;
====cable specific data:====
*the description of basic geometric properties of the cable;
*the description of the interface definition of the cable;
*the description of the functional definition of the cable;
*representation of an instance of a cable in an assembly including connector placement;
====electrical connector specific data:====
*the description of the equivalent functional network for the connector;
*the description of physical mating characteristics;
*the classification of connector terminals;
*representation of an instance of a connector included in a physical layer protocol definition;
*representation of an instance of a connector included in an interface definition;
*representation of an instance of a connector included in an assembly as a socket for another component;
*representation of an instance of a connector included in an assembly as an interface of that assembly;
*representation of an instance of a connector included in a cable interface definition;
====requirement data:====
*the description of the functional and non-functional requirements for the product;
*the description of the functional and non-functional requirements for devices used in the assembly;
*the description of the functional and non-functional requirements for devices and features used in the physical interconnection;
*representation of electrical and thermal domain specific requirements;
*representation of geometric model based requirements;
*the configuration management of documents that contain requirements;
*the allocation of requirements to functional objects, physical objects, and the physical implementation;
*the allocation of requirements from functional objects to their physical implementation;
*the description of the constraints on the design of the interconnect that assure product performance, incorporate quality, and enhance manufacturing process capabilities;
*the description of production rules that represent requirements and constraints;
====functional network data:====
*the hierarchical description of the functionality of the parts or devices that are used in an electronic assembly or interconnect;
*the hierarchical description of the functional objects that are combinations of one or more functional objects;
*the configuration management of the functional objects and networks that are being developed concurrently;
*the description of the connection among the functional objects;
*the binding of functional objects to simulation model templates;
*the identification of functional object libraries;
*representation of a functional test bench;
*the description of electrical and thermal networks;
*representation of binding a thermal network node to physical domain product data;
====physical network data:====
*the description of the components that are in the role of function implementation for the functional network elements;
*the description of the connection among the components that are in the role of function implementation;
*the description of path based requirements for connections between physical terminals based on functional performance measures;
*the description of path based requirements for connections between classes of physical terminals based on functional performance measures;
*the configuration management of the physical network;
*the identification of the domain of the physical network;
====assembly data:====
*the physical layout of the assembly, including a description of the placement of the physical objects in the assembly;[[#CO_Basic_assembly]]
*the description of the constraints on the design of the assembly that assure product performance, incorporate quality, and enhance manufacturing process capabilities;
*the allocation of domain specific elements of the assembly design description to the interface description of a part or device;
*the description of assemblies to implement various functional domains including, but not limited to, analogue, digital, video, radio frequency, and microwave;
*the allocation of each specific connection among the devices used in the assembly to the component or group of components that realizes that connection;
*products that are electrical assemblies or that are mechanical assemblies;
*the description of assemblies that include more than one instance of a component in the role of interconnect;
*representation of an instance of a part in an assembly through its usage in a sub-assembly;
*the description of assembly panels used for manufacturing assemblies in lot quantities;
*representation of the joint between a feature of a component in the role of interconnect and a feature of a component that is in the role of function implementation;

====discrete wiring based interconnect data:====
*the description of the wires that help realize the interconnect;
*representation of a wire in an assembly, including the wire shape and termination shape;
*the description of other components in the assembly that help realize the interconnect;
====cable based interconnect data:====
*the description of the cables that help realize the interconnect;
*representation of the shape of the cable in an assembly, including the cable centreline curve and connector locations;
====layered substrate based interconnect data:====
*the description of the material stackup, including stackups for sequential laminates and complex configurations of multiple sub-stacks;
*the description of conductive and non-conductive materials and patterns;
*the description of composite structures for non-conductive materials;
*representation of hierarchical footprint patterns, including breakout patterns;
*geometric patterns that include product data to explicitly represent detailed design intent;
*geometric patterns that do not include detailed design intent knowledge;
*representation of manufacturing requirements using geometric properties or electrical impedance properties;
*geometric patterns that are manufacturable descriptions of the design, including needed manufacturing geometric elements;
*the allocation of domain specific elements of the interconnect design description to the interface description of a part or device;
*the description of interconnect design where transmission line effects are ignored;
*the description of interconnect design where terminals are point on surface, point on edge, or an area in cross section of the interconnect;
*the description of interconnect design where transmission line effects are modeled using transmission line templates;
*the description of interconnect design where each element in the design is separately modeled using microwave design template library;
*the functional and physical description of features realized as part of the interconnect, including material characteristics and composition;
*representation of an instance of a part in an interconnect through its usage as an embedded component;
*representation of assembly manufacturing specific features;
*representation of test manufacturing specific features;
*representation of fabrication manufacturing specific features;
*the description of fabrication panels used for manufacturing substrates in lot quantities;
====multi-domain model data:====
*the description of electrical, thermal, mechanical sub-models;
*two-dimensional geometric representations of sub-models;
*three-dimensional geometric representations of sub-models;
*the description of the explicit relationships required to maintain consistency between the sub-models;
*two dimensional shape representations of a part or device, assembly, or interconnect:
*geometrically bounded surface models;
*non surface bounded solid models using constructive solid geometry;
====three dimensional shape representations of a part or device, assembly, or interconnect:====
*geometrically and topologically bounded wireframe models;
*geometrically bounded surface models;
*topologically bounded solid models with facetted, elementary and advanced faces;
*non surface bounded solid models including constructive solid geometry, curve swept and other swept solids, thickened face solid;
*solids with construction history;
*topologically bounded manifold surface and subsurface and non manifold surface models;
*topologically bounded compound models;
*geometric validation properties to allow the translation of geometric shape representations (advanced boundary representation and faceted boundary representation solids) to be checked for quality;
*geometric and dimensional tolerances applied to geometric shape representations;
*three dimensional presentation of product data:
*arranging geometric elements in layers and groups and assigning colours;
*presentation styles for points, curves, surfaces and sections, including hatching and tiling;
*saved views of particular camera positions and sections;
*textual annotation and notes applied to geometric elements;
*presentation of geometric and dimensional tolerances;
*technical drawings as two dimensional presentation of product data.