AP210 Use Cases

From WikiSTEP

• Interconnect validation

• Requirements traceability

• PCA/PCB Durability analysis

• Visualization/ virtual product walkthroughs for design review

• PCA/PCB Warpage Analysis
  • NIST-GIT AP210 Project Website

• PWA/PWB Mechanical Analysis
  • NIST-GIT AP210 Project Website

• DFM Rule Checker[1]

• DFT Rule Checker[2]

• Gerber to AP 210[3]

• PCB Stackup Design[4]

• ECAD/MCAD data exchange[5]

• Component Library

• Footprint Library

• PCB/PWB GD&T data to fabrication

• PCA/PCB optimization through supply chain interaction

• Other Use Cases

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backup for use cases, potential and realized.

• AP 210 Uses in Design Support:
  • Electromechanical Assembly
  • Multiple Sub Assemblies in an Assembly
  • Design Macros for Assembly and Interconnect
  • Component Grouping model
  • Design Classes
  • Interconnect Substrate Design
  • Multiple Interconnect substrates in an Assembly
  • Multiple Cables in an Assembly
  • Formal partitioning of a netlist into the elements in the Assembly that implement the netlist
  • Delay model
  • Formal Interface Control Model for Assembly
    • Formal Protocol Definition
    • Externally Visible Connector Definitions
    • Mounting holes
    • Mating features
    • Shrink Wrapped Mechanical Model
    • Shrink Wrapped Functional Model
  • Formal Interface Control Model for Interconnect
    • Mounting holes
    • Mating features
    • Shrink Wrapped Mechanical Model
    • Shrink Wrapped Functional Model

• AP 210 Uses in Manufacturing Support:
  • PCB Fabrication
    • GD&T
    • Tooling Holes
    • Detailed Laminate Stackup model including IPC material references
    • Detailed Material Property support
  • PCA Assembly
    • Automated Assembly Line support
      • Tooling holes
      • Fiducials
    • Manual Assembly Support
  • PCA Test
    • Component physical and functional Properties
    • Physical Netlist
    • Testpoints
    • Component location and reference designation

• AP 210 Uses in Analysis Support:
  • Thermal
  • Structural
  • Electrical
• Support Simulation
  • Netlist Extraction
  • Property Extraction
• Support Design Changes:
  • Track Requirements
  • Track Changes
  • Semi-automated library support
• Support Procurement:
  • Electronic TDP (Technical Data Package)
  • RFQ Generation
  • BID Generation

• AP 210 can support drawing exchange since AP 210 is a superset of AP 203

• AP 210 Package Model
  • JEDEC Drawings
  • Supports GD&T

• AP 210 Packaged Part Model
  • MIL Spec Part Drawings
  • Vendor Spec Sheets
  • Supports explicit mapping to schematic symbol terminals

• AP 210 3D Assembly Model
  • Assembly Drawings
  • Combined Electrical and Mechanical Assemblies in one assembly model
  • Captures all Assembly notes in Requirements property based structure

• AP 210 Interconnect substrate Model
  • Fabrication Drawings
  • Fabrication Inspection Requirements (via GD&T)
  • Drill Drawings
  • Captures all Fabrication Notes in Requirements property based structure

• AP 210 Requirements Model
  • AP 210 is harmonized with AP 233 in common areas

• AP 210 Requirement Allocation Model
  • Allocation and traceability of requirements to assembly, component, feature, GD&T, interconnect substrate, net, trace, copper..
  • Storage of requirement allocation is unique to STEP APs.
  • Only AP 210 has explicit requirement allocation traceability to electrical domain objects

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