AP210 Scope

From WikiSTEP

Contents 1 configuration control data pertaining to the design phase of a product's development: 2 characterization data: 3 interface data: 4 simulation model data: 5 material data: 6 generic part or device data: 7 mechanical part data: 8 generic electrical part or device data: 9 electrical part or device data specific to designs that include layered interconnect: 10 bare semiconductor device specific data: 11 cable specific data: 12 electrical connector specific data: 13 requirement data: 14 functional network data: 15 physical network data: 16 assembly data: 17 discrete wiring based interconnect data: 18 cable based interconnect data: 19 layered substrate based interconnect data: 20 multi-domain model data: 21 three dimensional shape representations of a part or device, assembly, or interconnect:

configuration control data pertaining to the design phase of a product's development:

characterization data:

• the association of characteristics to classes, functional objects, physical objects, and analytical models;
• the identification of planned parameters for functional objects, assemblies, interconnect, components, and analytical models;
• the identification of actual parameters for functional objects, assemblies, interconnect, components, and analytical models;
• the description of catalog data including explicit capability for binding externally defined data element type identifiers to product data types;
• the configuration management of characterization data;
• representation of standard si units, derived si units and units defined in other systems of units;
• representation of class hierarchies for product data;

interface data:

• the behavioural description of devices or physical objects, including the functional interface definition;
• the description of the physical interface of devices or physical objects, including material characteristics and composition of the interface;
• the behavioural description of features realized as part of the interconnect, including the functional interface definition;
• the description of the physical interface of features realized as part of the interconnect, including material characteristics and composition;
• the mapping between the functional and physical interface definitions;

simulation model data:

• the configuration management of analytical model templates that are being developed concurrently;
• the explicit interface to externally defined analytical models that define the behaviour of a functional object, a device, a physical object, an electronic assembly, or an interconnect;
• the classification and description of analytical model template ports;
• the identification of analytical model template libraries;

material data:

• materials and their composition of chemical substance;
• composite material product structure, shape and material properties;
• classification of materials according to domain specific conductivity performance measures;
• characterization of surface conditions including surface finish;

generic part or device data:

• the functional description of devices or physical objects, including mapping between functional and physical terminals;
• the physical description of devices or physical objects, including material characteristics and composition;
• the configuration management of constituent parts or devices that are being concurrently developed;
• the identification of libraries used for synthesis and design re-use;
• catalogue data characterized by property value pairs or by data tables;
• substitute and alternate product data;
• approved supplier data;

mechanical part data:

• the physical description of devices or physical objects, including material characteristics and composition;
• the configuration management of constituent parts or devices that are being concurrently developed;
• the identification of libraries used for synthesis and design re-use;
• products that are mechanical parts;
• catalogue data characterized by property value pairs or by data tables;

generic electrical part or device data:

• the functional description of devices or physical objects, including mapping between functional and physical terminals;
• the physical description of devices or physical objects, including material characteristics and composition;
• the configuration management of constituent parts or devices that are being concurrently developed;
• the configuration management of programmable devices and assemblies;
• the identification of libraries used for synthesis and design re-use;
• products that are electrical parts;
• catalogue data characterized by property value pairs or by data tables;

electrical part or device data specific to designs that include layered interconnect:

• the functional description of devices or physical objects, including mapping between functional and physical terminals;
• the physical description of devices or physical objects, including material characteristics and composition;
• the configuration management of constituent parts or devices that are being concurrently developed;
• the configuration management of programmable devices and assemblies;
• the identification of libraries used for synthesis and design re-use;
• products that are electrical parts;
• catalogue data characterized by property value pairs or by data tables;
• the description of conductive pattern templates associated with the part or device;
• the externally accessible connection areas in the physical description of the device;
• the externally accessible surfaces in the physical description of the device;
• the classification of terminals in the physical description of the device;
• representation of interface and seating planes in the physical description of the device;
• the classification of device terminals;
• the physical description of terminal templates including connection areas;
• representation of the geometric relationship between two-dimensional and three-dimensional models of the device;
• representation of the shape of a device under different application contexts and material conditions;
• representation of an instance of a device in an assembly;

bare semiconductor device specific data:

• the device connection areas;
• the device surfaces;
• the classification of device terminals;
• representation of an instance of a device in an assembly;

cable specific data:

• the description of basic geometric properties of the cable;
• the description of the interface definition of the cable;
• the description of the functional definition of the cable;
• representation of an instance of a cable in an assembly including connector placement;

electrical connector specific data:

• the description of the equivalent functional network for the connector;
• the description of physical mating characteristics;
• the classification of connector terminals;
• representation of an instance of a connector included in a physical layer protocol definition;
• representation of an instance of a connector included in an interface definition;
• representation of an instance of a connector included in an assembly as a socket for another component;
• representation of an instance of a connector included in an assembly as an interface of that assembly;
• representation of an instance of a connector included in a cable interface definition;

requirement data:

• the description of the functional and non-functional requirements for the product;
• the description of the functional and non-functional requirements for devices used in the assembly;
• the description of the functional and non-functional requirements for devices and features used in the physical interconnection;
• representation of electrical and thermal domain specific requirements;
• representation of geometric model based requirements;
• the configuration management of documents that contain requirements;
• the allocation of requirements to functional objects, physical objects, and the physical implementation;
• the allocation of requirements from functional objects to their physical implementation;
• the description of the constraints on the design of the interconnect that assure product performance, incorporate quality, and enhance manufacturing process capabilities;
• the description of production rules that represent requirements and constraints;

functional network data:

• the hierarchical description of the functionality of the parts or devices that are used in an electronic assembly or interconnect;
• the hierarchical description of the functional objects that are combinations of one or more functional objects;
• the configuration management of the functional objects and networks that are being developed concurrently;
• the description of the connection among the functional objects;
• the binding of functional objects to simulation model templates;
• the identification of functional object libraries;
• representation of a functional test bench;
• the description of electrical and thermal networks;
• representation of binding a thermal network node to physical domain product data;

physical network data:

• the description of the components that are in the role of function implementation for the functional network elements;
• the description of the connection among the components that are in the role of function implementation;
• the description of path based requirements for connections between physical terminals based on functional performance measures;
• the description of path based requirements for connections between classes of physical terminals based on functional performance measures;
• the configuration management of the physical network;
• the identification of the domain of the physical network;

assembly data:

• the physical layout of the assembly, including a description of the placement of the physical objects in the assembly;#CO_Basic_assembly
• the description of the constraints on the design of the assembly that assure product performance, incorporate quality, and enhance manufacturing process capabilities;
• the allocation of domain specific elements of the assembly design description to the interface description of a part or device;
• the description of assemblies to implement various functional domains including, but not limited to, analogue, digital, video, radio frequency, and microwave;
• the allocation of each specific connection among the devices used in the assembly to the component or group of components that realizes that connection;
• products that are electrical assemblies or that are mechanical assemblies;
• the description of assemblies that include more than one instance of a component in the role of interconnect;
• representation of an instance of a part in an assembly through its usage in a sub-assembly;
• the description of assembly panels used for manufacturing assemblies in lot quantities;
• representation of the joint between a feature of a component in the role of interconnect and a feature of a component that is in the role of function implementation;

discrete wiring based interconnect data:

• the description of the wires that help realize the interconnect;
• representation of a wire in an assembly, including the wire shape and termination shape;
• the description of other components in the assembly that help realize the interconnect;

cable based interconnect data:

• the description of the cables that help realize the interconnect;
• representation of the shape of the cable in an assembly, including the cable centreline curve and connector locations;

layered substrate based interconnect data:

• the description of the material stackup, including stackups for sequential laminates and complex configurations of multiple sub-stacks;
• the description of conductive and non-conductive materials and patterns;
• the description of composite structures for non-conductive materials;
• representation of hierarchical footprint patterns, including breakout patterns;
• geometric patterns that include product data to explicitly represent detailed design intent;
• geometric patterns that do not include detailed design intent knowledge;
• representation of manufacturing requirements using geometric properties or electrical impedance properties;
• geometric patterns that are manufacturable descriptions of the design, including needed manufacturing geometric elements;
• the allocation of domain specific elements of the interconnect design description to the interface description of a part or device;
• the description of interconnect design where transmission line effects are ignored;
• the description of interconnect design where terminals are point on surface, point on edge, or an area in cross section of the interconnect;
• the description of interconnect design where transmission line effects are modeled using transmission line templates;
• the description of interconnect design where each element in the design is separately modeled using microwave design template library;
• the functional and physical description of features realized as part of the interconnect, including material characteristics and composition;
• representation of an instance of a part in an interconnect through its usage as an embedded component;
• representation of assembly manufacturing specific features;
• representation of test manufacturing specific features;
• representation of fabrication manufacturing specific features;
• the description of fabrication panels used for manufacturing substrates in lot quantities;

multi-domain model data:

• the description of electrical, thermal, mechanical sub-models;
• two-dimensional geometric representations of sub-models;
• three-dimensional geometric representations of sub-models;
• the description of the explicit relationships required to maintain consistency between the sub-models;
• two dimensional shape representations of a part or device, assembly, or interconnect:
• geometrically bounded surface models;
• non surface bounded solid models using constructive solid geometry;

three dimensional shape representations of a part or device, assembly, or interconnect:

• geometrically and topologically bounded wireframe models;
• geometrically bounded surface models;
• topologically bounded solid models with facetted, elementary and advanced faces;
• non surface bounded solid models including constructive solid geometry, curve swept and other swept solids, thickened face solid;
• solids with construction history;
• topologically bounded manifold surface and subsurface and non manifold surface models;
• topologically bounded compound models;
• geometric validation properties to allow the translation of geometric shape representations (advanced boundary representation and faceted boundary representation solids) to be checked for quality;
• geometric and dimensional tolerances applied to geometric shape representations;
• three dimensional presentation of product data:
• arranging geometric elements in layers and groups and assigning colours;
• presentation styles for points, curves, surfaces and sections, including hatching and tiling;
• saved views of particular camera positions and sections;
• textual annotation and notes applied to geometric elements;
• presentation of geometric and dimensional tolerances;
• technical drawings as two dimensional presentation of product data.